23 results
Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples
-
- Journal:
- Journal of Materials Research / Volume 28 / Issue 23 / 14 December 2013
- Published online by Cambridge University Press:
- 06 November 2013, pp. 3257-3260
- Print publication:
- 14 December 2013
-
- Article
- Export citation
Evolution of the Sn/Ni–8.0 at.%V interfacial reaction paths
-
- Journal:
- Journal of Materials Research / Volume 26 / Issue 22 / 28 November 2011
- Published online by Cambridge University Press:
- 23 September 2011, pp. 2838-2843
- Print publication:
- 28 November 2011
-
- Article
- Export citation
Co alloying and size effects on solidification and interfacial reactions in the Sn–Zn–(Co)/Cu couples
-
- Journal:
- Journal of Materials Research / Volume 25 / Issue 12 / December 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2430-2438
- Print publication:
- December 2010
-
- Article
- Export citation
Investigations on interfacial reactions at reentrant corners
-
- Journal:
- Journal of Materials Research / Volume 25 / Issue 5 / May 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 999-1003
- Print publication:
- May 2010
-
- Article
- Export citation
250 °C isothermal section of ternary Sn-In-Cu phase equilibria
-
- Journal:
- Journal of Materials Research / Volume 24 / Issue 8 / August 2009
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2628-2637
- Print publication:
- August 2009
-
- Article
- Export citation
Characterization of the ternary phase at the Sn/Ni–V joint
-
- Journal:
- Journal of Materials Research / Volume 23 / Issue 10 / October 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2743-2748
- Print publication:
- October 2008
-
- Article
- Export citation
Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V
-
- Journal:
- Journal of Materials Research / Volume 23 / Issue 7 / July 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1895-1901
- Print publication:
- July 2008
-
- Article
- Export citation
Thermodynamic descriptions of the Cu–Zn system
-
- Journal:
- Journal of Materials Research / Volume 23 / Issue 1 / January 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 258-263
- Print publication:
- January 2008
-
- Article
- Export citation
Cruciform pattern formation in Sn/Co couples
-
- Journal:
- Journal of Materials Research / Volume 22 / Issue 12 / December 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 3404-3409
- Print publication:
- December 2007
-
- Article
- Export citation
Thermodynamic description of the Cu–Sn system
-
- Journal:
- Journal of Materials Research / Volume 22 / Issue 11 / November 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 3158-3165
- Print publication:
- November 2007
-
- Article
- Export citation
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
-
- Journal:
- Journal of Materials Research / Volume 22 / Issue 10 / October 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2924-2929
- Print publication:
- October 2007
-
- Article
- Export citation
Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging
-
- Journal:
- Journal of Materials Research / Volume 22 / Issue 7 / July 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1975-1986
- Print publication:
- July 2007
-
- Article
- Export citation
Effects of electromigration on interfacial reactions in cast Sn/Cu joints
-
- Journal:
- Journal of Materials Research / Volume 22 / Issue 3 / March 2007
- Published online by Cambridge University Press:
- 03 March 2011, pp. 695-702
- Print publication:
- March 2007
-
- Article
- Export citation
Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions
-
- Journal:
- Journal of Materials Research / Volume 21 / Issue 12 / December 2006
- Published online by Cambridge University Press:
- 03 March 2011, pp. 3065-3071
- Print publication:
- December 2006
-
- Article
- Export citation
Interfacial reactions of Sn-Cu/Ni couples at 250 °C
-
- Journal:
- Journal of Materials Research / Volume 21 / Issue 9 / September 2006
- Published online by Cambridge University Press:
- 03 March 2011, pp. 2270-2277
- Print publication:
- September 2006
-
- Article
- Export citation
Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples
-
- Journal:
- Journal of Materials Research / Volume 21 / Issue 7 / July 2006
- Published online by Cambridge University Press:
- 01 July 2006, pp. 1849-1856
- Print publication:
- July 2006
-
- Article
- Export citation
Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C
-
- Journal:
- Journal of Materials Research / Volume 21 / Issue 7 / July 2006
- Published online by Cambridge University Press:
- 01 July 2006, pp. 1712-1717
- Print publication:
- July 2006
-
- Article
- Export citation
Effects of temperature on interfacial reactions in γ–InSn4/Ni couples
-
- Journal:
- Journal of Materials Research / Volume 21 / Issue 5 / May 2006
- Published online by Cambridge University Press:
- 01 May 2006, pp. 1161-1166
- Print publication:
- May 2006
-
- Article
- Export citation
Liquidus projection of the ternary Ag–Sn–Ni system
-
- Journal:
- Journal of Materials Research / Volume 19 / Issue 8 / August 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 2262-2267
- Print publication:
- August 2004
-
- Article
- Export citation
Phase equilibria of the Ag–Sn–Cu ternary system
-
- Journal:
- Journal of Materials Research / Volume 19 / Issue 8 / August 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 2298-2305
- Print publication:
- August 2004
-
- Article
- Export citation